| 摘要 |
According to an embodiment of the present invention, a light emitting device package comprises: a light emitting device including a light emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a package body; a first lead frame and a second lead frame which are arranged at the package body and are installed to be electrically separated from each other; a first solder unit arranged between the first lead frame and the first conductive semiconductor layer in a solid slice form; and a second solder unit arranged between the second lead frame and the second conductive semiconductor layer in a solid slice form. The light emitting device package of the present invention has improved adhesive strength and reliability. |
