SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

A method for treating a substrate includes a substrate maintaining process of maintaining a substrate in a horizontal posture by using a substrate maintaining rotary mechanism, a treatment liquid discharging process of discharging the treatment liquid from a discharge hole towards the substrate by introducing the treatment liquid from a fluid introducing part at one end of a treatment liquid pipe having a treatment liquid nozzle having the discharge hole at a tip end thereof, at an opposite end thereof, a gas pressing/discharging process of pressing and discharging the treatment liquid in the treatment liquid pipe and the treatment liquid nozzle outwards by introducing a gas from the fluid introducing part into the treatment liquid pipe after the treatment liquid discharging process is stopped, and a gas introduction stopping process of stopping introduction of the gas into the treatment liquid pipe while the treatment liquid resides in the treatment pipe and/or the treatment liquid nozzle after the introduction of the gas is initiated.