| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carry-out/in device in which a plurality of wafers are conveyed automatically and processed continuously with a simple configuration while decreasing the number of components, at a low manufacturing cost. <P>SOLUTION: A unit support part is configured to have a rising portion formed radially from the center of rotation to the outer periphery of a turntable, and a fan-shaped mounting surface inclining from the rising portion to the lower end of an adjacent rising portion. Consequently, a plurality of unit support parts are formed in the revolving direction of the turntable, workpiece units are mounted one by one on the mounting surface of the unit support part, and can be mounted on the adjoining unit support parts in the positional relation not coming into contact with each other but being superimposed in the vertical direction. A frame holding means for holding the frame is disposed on the mounting surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
