| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, adhesion, resist shape, tent reliability, scum generation resistance, and chemical resistance, and to provide a photosensitive element, a method of forming a resist pattern and a method of making a printed wiring board using the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition comprises: a binder polymer that has a dispersion degree of 1.6 or less; a photopolymerizable compound including at least one compound selected from the group consisting of a (meth)acrylate compound having a skeleton derived from pentaerythritol and a (meth)acrylate compound having a skeleton derived from dipentaerythritol; and a photopolymerization initiator. <P>COPYRIGHT: (C)2013,JPO&INPIT |
