发明名称 Deposition apparatus and methods
摘要 A deposition apparatus (20) includes a deposition chamber (22) and a deposition material source (32). An electron beam source (44) is positioned to direct a first electron beam (42) to vaporize a portion of the deposition material. A first electrode (60) is provided for generating a primary plasma (100) from the deposition material source (32). A second electrode (90) is provided for generating a secondary plasma (104) and further accelerating ions from the primary plasma (100). A bias electric potential is applied to the workpiece (26) to draw ions from the secondary plasma to the workpiece (26). A control system (88) is coupled to the electron beam source (44), the bias voltage source (48), and power supplies (62,92) for the first and second electrodes (60,90).
申请公布号 EP2482303(B1) 申请公布日期 2016.04.06
申请号 EP20120151173 申请日期 2012.01.13
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 KUZMICHEV, ANATOLY;BELOUSOV, IGOR V.;KONONENKO, YURIY G.;MULLOOLY, JOHN F.
分类号 H01J37/302;C23C14/16;C23C14/32;H01J37/305 主分类号 H01J37/302
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