发明名称 |
Deposition apparatus and methods |
摘要 |
A deposition apparatus (20) includes a deposition chamber (22) and a deposition material source (32). An electron beam source (44) is positioned to direct a first electron beam (42) to vaporize a portion of the deposition material. A first electrode (60) is provided for generating a primary plasma (100) from the deposition material source (32). A second electrode (90) is provided for generating a secondary plasma (104) and further accelerating ions from the primary plasma (100). A bias electric potential is applied to the workpiece (26) to draw ions from the secondary plasma to the workpiece (26). A control system (88) is coupled to the electron beam source (44), the bias voltage source (48), and power supplies (62,92) for the first and second electrodes (60,90). |
申请公布号 |
EP2482303(B1) |
申请公布日期 |
2016.04.06 |
申请号 |
EP20120151173 |
申请日期 |
2012.01.13 |
申请人 |
UNITED TECHNOLOGIES CORPORATION |
发明人 |
KUZMICHEV, ANATOLY;BELOUSOV, IGOR V.;KONONENKO, YURIY G.;MULLOOLY, JOHN F. |
分类号 |
H01J37/302;C23C14/16;C23C14/32;H01J37/305 |
主分类号 |
H01J37/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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