发明名称 はんだ接合用積層体および接合体
摘要 The invention provides a laminated body for solder joint. The laminated body for solder joint comprises, in order, a metal nano-particle sintered body layer, a shield layer containing metal particles or metal oxide particles, and a solder joint layer. The invention also relates to a jointed body which comprises, in order, a first jointed body, a laminated body for the above solder joint, and a second jointed body.
申请公布号 JP5899623(B2) 申请公布日期 2016.04.06
申请号 JP20110027502 申请日期 2011.02.10
申请人 三菱マテリアル株式会社 发明人 山崎 和彦;馬渡 芙弓
分类号 B23K35/14;B23K35/30;H01B1/22;H01L31/0468;H01L33/62 主分类号 B23K35/14
代理机构 代理人
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