| 摘要 |
(Problem to be solved) The present invention improves the power supply efficiency of a flip chip connected electronic component while preventing a short circuit between terminals disposed at a small pitch. (Solution) A circuit board (10) has a plurality of terminals (61-63) for flip chip connection at a portion of an outermost conductive layer (24). A first opening (41) and a second opening (42) are formed in an electronic component mounting area (54) of a resin insulating layer (23) on the outermost layer. The first opening (41) exposes only one power terminal (62) or one ground terminal (63). The second opening (42) exposes a plurality of signal terminals (61). A reinforcing part (64) forming a portion of the resin insulating layer (23) forms an inner bottom surface (S2) of the second opening (42). A height (h1) of a part of the terminals (62,63) exposed in the first opening (41), which protrudes from an inner bottom surface (S1) of the first opening (41) is greater than a height (h2) of the terminal (61) exposed in the second opening (42), which protrudes from the inner bottom surface (S2) of the second opening (42). |
