发明名称 基板と電子部品の接続構造
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of a substrate and an electronic component, which inhibits contact slide and decreases contact resistance.SOLUTION: A connection structure electrically connects a connection terminal on one surface of a printed circuit board with a connection terminal of an electronic component arranged on the other surface side of the printed circuit board, and causes a lead wire connection terminal of the electronic component to project from the one surface of the printed circuit board via a through hole formed in the printed circuit board to be electrically connected with the connection terminal on the one surface of the printed circuit board. The connection structure comprises a first contact formed by bending a conductive blade spring, a second contact provided on the conductive blade spring and a vibration absorption part provided on the conductive blade spring, in which the first contact is connected so as to be tucked in the lead wire connection terminal and the second contact is soldered on the connection terminal on the one surface of the printed circuit board.
申请公布号 JP5900573(B2) 申请公布日期 2016.04.06
申请号 JP20140207512 申请日期 2014.10.08
申请人 株式会社デンソー 发明人 立花 康之;三宅 敏広;山田 晃
分类号 H05K1/18 主分类号 H05K1/18
代理机构 代理人
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