| 摘要 |
Provided is a cooling device for a semiconductor module that eliminates the increase in temperature occurring only at some of semiconductor elements and enables uniform and stable cooling of semiconductor elements. The cooling device for a semiconductor module supplies a coolant from the outside into a water jacket (2A) and cools semiconductor elements disposed on an outer surface thereof. An introducing port (24) and a discharge port (25) are disposed at a left wall (2Ab) of the water jacket (2A), and an introducing port section (21a) and a discharge port section (22a) protrude from the same left wall (2Ab). A flow velocity adjusting plate (28) is disposed parallel to fins (2C) in a coolant discharge flow channel (22) serving as the second flow channel disposed parallel to and at a distance from a coolant introducing flow channel (21) serving as the first flow channel. The adjustment of flow velocity distribution in the fins (2C) can be performed by using the pressure generated when the coolant collides with the flow velocity adjusting plate (28). |
