| 摘要 |
Provided is an electrically conductive adhesive composition including: electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220°C; a thermosetting resin (B); a flux activator (C); and a curing catalyst (D), in which a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200°C. |
