| 摘要 |
The invention provides a bare chip supplier applied for supplying bare chips picked from bare chip integrators formed by cutting wafers, which can increase the practicality. A plurality of nozzle installed tools of a pickup head are respectively provided with a plurality of nozzles. A nozzle accommodating device (100) accommodating a plurality of nozzles (44) is arranged on the bare chip supplier. Furthermore, the nozzle accommodating device accommodates the nozzles in a way to have the same corresponding relations as the nozzles and the nozzle installed tools are corresponding to one another. The nozzle accommodating device is provided with nozzle operation mechanisms (120) (122) (124) (126) (128) which make the nozzle simultaneously work when the pickup head is meanwhile installed. The nozzles can be rapidly installed. Meanwhile, the structure of the pickup head can be simpler and lighter. |
