| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively provide a tray suitable for semiconductor transportation by improving dust generation resistance, heat resistance, non-charging property, flatness, or the like. <P>SOLUTION: A transport tray of a surface mount electronic component used for transporting surface mount electronic components including semiconductor devices to the manufacturing step or the inspection step thereof is comprised of a plate part made of a material having at least one of conductivity and heat resistance of 100°C or more; and resin partition parts that are arranged in the shape of a rib on at least one surface of the plate part, and partition a plurality of spaces for storing the individual surface mount electronic components. The plate part and the partition parts are integrated with each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
