| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device having strong adhesion between a resin portion of a package and a lead frame and excellent in peeling resistance.SOLUTION: A light-emitting device includes: a package 30 configured by integrally molding two lens frames 20, 22 each having projection portions on an upper surface and a resin portion 10 including resin and a light reflection member; and a light-emitting element 50 arranged on an element placing surface of the package 30. The light-emitting element 50 has a face-down structure including a p-electrode and an n-electrode on the bottom side, the p-electrode is stuck to a top face of a projection portion 20b of one of the two lead frames 20, 22, and the n-electrode is stuck to a top face of a projection portion 22a of the other of the two read frames 20, 22. The resin portion 10 has a surface forming the element placing surface together with respective top faces of the projection portions 20a, 20b, 22a of the two lead frames 20, 22. |
