发明名称 防水構造および防水工法
摘要 One object of the present invention is to provide an interlayer adhesive which can firmly adhere a waterproof layer and an inorganic material layer, and problems of water leak or the like can be suppressed over the long term, and the present invention provides an interlayer adhesive which is interposed between a waterproof layer formed from a resin-coated film and an inorganic material layer using mortar or concrete to adhere the waterproof layer and the inorganic material layer to each other, the interlayer adhesive containing a resin composition obtained by reacting (a) a base resin including an emulsion of a main resin containing at least one of an acrylic-based resin, an ethylene-vinyl acetate-based resin, and an epoxy-based resin, with (b) an isocyanate compound having an isocyanate group.
申请公布号 JP5900785(B2) 申请公布日期 2016.04.06
申请号 JP20110144138 申请日期 2011.06.29
申请人 株式会社ダイフレックス 发明人 東 克洋;矢野 哲祥
分类号 E04D11/00;C09J133/00;E02D29/00;E02D31/02 主分类号 E04D11/00
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