| 摘要 |
The present invention provides a wedge-shaped tool used for wire bonding, capable of suppressing formation of deviation of a bonding area formed by the wedge-shaped tool and preventing pressure exertion of ultrasonic vibration from concentrating on a head side. A front-end portion of a tool main body (11) is provided with a wire maintaining part for maintaining a bonding wire (1) through a slot part (20), while aluminium bonding wire (1) is extracted towards the part, ultrasonic vibration is exerted between electrodes (7) on a semiconductor chip (3), so as to form an adhering nuclear layer (8), thus the bonding wire (1) is connected. In the state of extending the bonding wire (1) from the slot part (20), if the wedge-shaped tool (10) is pressed towards the electrodes (7), elliptical plastic deformation occurs on the bonding part. The front-end portion of the tool main body (11) is provided with a slope angle alpha from a root part H to the head part T along a length direction of the bonding wire (1), the bonding wire (1) is pressed to be a bonding surface of which the head side is closer to the electrodes (7) than the root part side. |
