| 摘要 |
A semiconductor package and a manufacturing method thereof are provided. According to an embodiment of the present invention, the semiconductor package comprises: a package substrate; a semiconductor chip mounted on the package substrate and electrically connected to the package substrate; a first protective layer covering the semiconductor chip and having flexibility; and a second protective layer arranged on the first protective layer and having flexibility wherein the first protective layer comprises a first binder resin, a first hardener, a first hardening catalyst, and a first filler. According to the semiconductor package of the present invention, protective layers protecting the semiconductor chip have flexibility, and thus, the semiconductor package can be bent. |
