发明名称 Circuit board assembly using metal plates as conducting medium embedded therein
摘要 A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.
申请公布号 US9307628(B2) 申请公布日期 2016.04.05
申请号 US201313868575 申请日期 2013.04.23
申请人 KING SHING INDUSTRIAL CO., LTD. 发明人 Shin Chun-Chin
分类号 H05K7/20;H05K1/03;H05K1/16;B23P19/00;H05K1/02;H05K1/18;H05K3/20;G06F1/20;H05K1/14 主分类号 H05K7/20
代理机构 Sinorica, LLC 代理人 Chow Ming;Sinorica, LLC
主权项 1. A circuit board assembly comprising: a substrate; wirings formed inside the substrate and made of copper foils; a digital/analog converter formed on the substrate; an analog/digital converter formed on the substrate; metal plates formed inside and partly exposed out of the substrate for electrical connection; an encapsulation enclosing the substrate and partly enclosing the metal plate and having holes to allow extension of the metal plates; and electronic components mounted on the substrate to electrically connect to the wiring and the metal plates; wherein the metal plates are not electrically connected to printed circuit board, and are provided with electrical connections in a circuit.
地址 Taoyuan County TW