Die seal ring for integrated circuit system with stacked device wafers

摘要

An integrated circuit system includes a first device wafer bonded to a second device wafer at a bonding interface of dielectrics. Each wafer includes a plurality of dies, where each die includes a device, a metal stack, and a seal ring that is formed at an edge region of the die. Seal rings included in dies of the second device wafer each include a first conductive path provided with metal formed in a first opening that extends from a backside of the second device wafer, through the second device wafer, and through the bonding interface to the seal ring of a corresponding die in the first device wafer.

主权项

1. A method of fabricating an integrated circuit system, the method comprising:
providing a first die including:
a first device formed in an integrated circuit region of a first semiconductor layer, anda first metal stack formed on the first semiconductor layer, the first metal stack including one or more metal layers formed in a dielectric layer; providing a second die including:
a second device formed in an integrated circuit region of a second semiconductor layer, anda second metal stack formed on the second semiconductor layer, the second metal stack including one or more metal layers formed in a dielectric layer; bonding a front side of the first die to a front side of the second die by bonding the first metal stack to the second metal stack along a bonding interface between the dielectric layer of the first metal stack and the dielectric layer of the second metal stack; and forming a two-part seal ring in the stacked die, wherein forming the two-part seal ring comprises:
forming a first seal ring in an edge region of the first die, wherein the first seal ring is formed in the first metal stack, surrounds the integrated circuit region of the first die, and includes at least one via coupled to at least one metal layer of the first metal stack, andforming a second seal ring in an edge region of the second die, wherein the second seal ring surrounds the integrated circuit region of the second die, and wherein the second seal ring includes a conductive path that extends from a backside of the second die through the second semiconductor layer, the second metal stack, and the bonding interface to the first seal ring, wherein the conductive path is electrically coupled to at least one metal layer of the second metal stack and is electrically coupled to at least one via of the first seal ring or at least one metal layer of the first metal stack.