发明名称 Sealing system for creating sealed letter by use of envelope sheet with bond part
摘要 A sealing system for creating a sealed letter by use of an envelope sheet with a bond part on a basis of a sealing setting. The sealing system includes a transmission amount detector configured to detect an amount of transmission of the envelope sheet being conveyed on a conveyance path, a bond position calculator configured to calculate a first bond position where the bond part exists in the envelope sheet on a basis of the amount of transmission as detected by the transmission amount detector, and a judgment unit configured to judge whether the envelope sheet is conveyed a correct way round in a conveyance direction of the envelope sheet, from the first bond position as calculated by the bond position calculator and a second bond position based on the sealing setting.
申请公布号 US9302443(B2) 申请公布日期 2016.04.05
申请号 US201313765270 申请日期 2013.02.12
申请人 RISO KAGAKU CORPORATION 发明人 Yabune Hirokazu
分类号 G06F7/00;B31B1/88;B31B39/00;B43M5/04 主分类号 G06F7/00
代理机构 Greenblum & Bernstein, P.L.C. 代理人 Greenblum & Bernstein, P.L.C.
主权项 1. A sealing system for creating a sealed letter including an envelope sheet with at least one bond part, the sealing system comprising: a transmission amount detector configured to detect an amount of transmission of the envelope sheet being conveyed on a conveyance path; a bond position calculator configured to calculate a first bond position based on the amount of transmission detected by the transmission amount detector, the first bond position being a position on the envelope sheet where the at least one bond part is located; and a judgment unit configured to judge whether the envelope sheet is conveyed in a predetermined position relative to a conveyance direction of the envelope sheet, wherein the judgement unit judges whether the envelope sheet is conveyed in the predetermined position by comparing the first bond position, as calculated by the bond position calculator, with a second bond position, the second bond position being set based on a predetermined sealing setting.
地址 Tokyo JP