Device for emulating temperature of an exothermic composite structure through a thermal cure cycle

摘要

A temperature emulator may include a stacked assembly including a pair of end plates positioned at an uppermost and lowermost location of the stacked assembly, a plurality of heat sink plates positioned between the pair of end plates, a plurality of shim plates positioned between adjacent pairs of heat sink plates, and an exothermic charge assembly positioned between at least one pair of heat sink plates, the exothermic charge assembly including an exotherm charge configured to react exothermally in response to a thermal cure cycle.

主权项

1. A temperature emulator comprising:
a plurality of thermally conductive plates configured in a stacked assembly, wherein said plurality of thermally conductive plates define an open cavity in said stacked assembly; and an exotherm charge disposed between at least one adjacent pair of thermally conductive plates of said plurality of thermally conductive plates.