发明名称 Acidic gold alloy plating solution
摘要 A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
申请公布号 US9303326(B2) 申请公布日期 2016.04.05
申请号 US201113292776 申请日期 2011.11.09
申请人 发明人 Morii Yutaka;Orihashi Masanori
分类号 C25D3/62;C25D5/12 主分类号 C25D3/62
代理机构 代理人 Piskorski John J.
主权项 1. An acidic gold alloy plating solution consisting of gold cyanide or salt thereof, cobalt ions, one or more acids or salts thereof selected from the group consisting of aminotrimethylene phosphonic acid, 1-hydroxyethyl-idene-1,1-diphosphonic acid, ethylenediamine tetramethylene phosphonic acid, diethylene-triamine pentamethylene phosphonic acid, phosphoric acid, sulfurous acid, amino acids and carboxylic acids wherein the carboxylic acids are selected from the group consisting of citric acid, tartaric acid, oxalic acid, succinic acid, adipic acid, malic acid, lactic acid, pyridine carboxylic acids, thiocarboxylic acids and benzoic acid, hexamethylene tetramine in amounts between 0.05 g/L and 10 g/L, and at least one nitrogen containing compound selected from the group consisting of alkanolamines, dialkanolamines, and trialkanolamines, the acidic gold alloy plating solution has a pH between 3 and 6 and water and optionally antifungal agents and optionally surfactants.
地址