Electrochemical deposition apparatus with remote catholyte fluid management

摘要

Techniques disclosed herein include an electro-chemical deposition apparatus that provides an efficient circulation system, chemical management that provides reliable and uniform plating, and a configuration that provides short maintenance times and greater tool availability. Techniques include a processing tank containing an anolyte fluid, and one or more plating cells each having a catholyte fluid compartment with a circulation path that connects to a separate or remote catholyte reservoir. Thus, with such a configuration, a single pump can be used to flow catholyte (via manifolds) through one or more plating cells. Thus, with the catholyte reservoir maintained off board, instead of dumping catholyte over a weir into a reservoir, catholyte fluid—after flowing through a plating cell—is returned to the catholyte reservoir.

主权项

1. An electrochemical deposition apparatus for depositing metal onto a substrate, the electrochemical deposition apparatus comprising:
a processing tank configured for holding an anolyte fluid, the processing tank sized sufficiently to receive one or more processing cells via a top opening of the processing tank; an electrochemical plating cell sized and configured to be removably inserted into the processing tank, the electrochemical plating cell defining a catholyte fluid compartment configured for holding a catholyte fluid, the catholyte fluid compartment providing a fluid boundary between anolyte fluid in the processing tank and catholyte fluid in the electrochemical plating cell; an ion exchange membrane removably coupled to the electrochemical plating cell, such that the ion exchange membrane is removably inserted into the processing tank along with the electrochemical plating cell, the ion exchange membrane providing a portion of the fluid boundary separating anolyte fluid in the processing tank from catholyte fluid in the electrochemical plating cell; an anode removably positioned within the processing tank, the anode being positioned adjacent to the ion exchange membrane and being positioned at a sufficient distance from the ion exchange membrane to permit anolyte fluid flow between the anode and the ion exchange membrane; a substrate holder configured to removably hold a substrate, the substrate holder configured to be removably inserted into the catholyte fluid compartment of the electrochemical plating cell such that the substrate is in contact with the catholyte fluid in the catholyte fluid compartment to deposit metal onto the substrate; a catholyte fluid circulation system configured to pump catholyte fluid from a catholyte reservoir to the electrochemical plating cell such that catholyte fluid flows across a surface of the substrate, the catholyte reservoir being located at a location remote from the processing tank; and an electrical system configured to generate a current between the anode and the substrate such that metal ions within the catholyte fluid are deposited on the substrate.