| 摘要 |
Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. |
| 主权项 |
1. A cooled electronic system comprising:
an electronic component; a cooling assembly having a larger footprint size than the electronic component, and comprising: a liquid-cooled cold plate comprising a thermally conductive material with a plurality of coolant-carrying channel sections extending therein, the liquid-cooled cold plate comprising a thermal conduction surface having a first surface area, and wherein the electronic component comprises a surface to be cooled, the surface to be cooled comprising a second surface area, wherein the liquid-cooled cold plate is oversized relative to the electronic component, with the first surface area of the thermal conduction surface of the liquid-cooled cold plate being greater than the second surface area of the surface to be cooled of the electronic component, and wherein heat is transferred from the surface to be cooled of the electronic component to the thermal conduction surface of the liquid-cooled cold plate, and the liquid-cooled cold plate comprises a first region where the surface to be cooled aligns to the liquid-cooled cold plate and a second region outside the first region, the second region being larger than the first region, and wherein at least one first coolant-carrying channel section of the plurality of coolant-carrying channel sections is disposed, at least in part, within the first region, and at least one second coolant-carrying channel section of the plurality of coolant-carrying channel sections of the liquid-cooled cold plate is disposed in the second region, outside the first region, and laterally offset from the electronic component; a thermal spreader disposed between the electronic component and the liquid-cooled cold plate and having opposing first and second external main surfaces, the first external main surface of the thermal spreader being detachably coupled to the thermal conduction surface of the liquid-cooled cold plate, and the thermal spreader being coextensive with the liquid-cooled cold plate, the thermal spreader comprising a plurality of heat pipes, each heat pipe having multiple heat pipe sections, at least one heat pipe section of the multiple heat pipe sections being partially aligned to the first region of the liquid-cooled cold plate, between the electronic component and the at least one first coolant-carrying channel section of the liquid-cooled cold plate, and partially aligned to the second region of the liquid-cooled cold plate, below the at least one second coolant-carrying channel section of the liquid-cooled cold plate, laterally away from the electronic component, the plurality of heat pipes of the thermal spreader facilitating distributing heat, laterally outward from the electronic component to the at least one second coolant-carrying channel section of the liquid-cooled cold plate in the second region of the liquid-cooled cold plate; and at least one coolant-carrying tube, the at least one coolant-carrying tube extending into, through and out from, the liquid-cooled cold plate and being embedded, where extending through the liquid-cooled cold plate, within the thermally conductive material at the thermal conduction surface thereof, the at least one coolant-carrying tube being exposed at the thermal conduction surface of the liquid-cooled cold plate so as to be coupled to the first external main surface of the thermal spreader, the at least one coolant-carrying tube comprising the plurality of coolant-carrying channel sections; and wherein the plurality of heat pipes contact each other lengthwise between the electronic component and the first region of the liquid-cooled cold plate. |
