| 发明名称 | Encapsulating composition and light emitting device | ||
| 摘要 | An encapsulating composition for a light emitting device includes a transparent resin, a plurality of light scattering particles distributed throughout the transparent resin and having an average particle size ranging from 190 nm to 450 nm, and a plurality of phosphor particles distributed throughout the transparent resin. A light emitting device includes the encapsulating composition and a light emitting diode that is encapsulated by the encapsulating composition. | ||
| 申请公布号 | US9306134(B2) | 申请公布日期 | 2016.04.05 |
| 申请号 | US201414278584 | 申请日期 | 2014.05.15 |
| 申请人 | DAXIN MATERIALS CORP. | 发明人 | Liao Yuan-Li;Lee Chang-Hung |
| 分类号 | H01L33/00;H01L33/56;C09K11/02;H01L33/50 | 主分类号 | H01L33/00 |
| 代理机构 | Young & Thompson | 代理人 | Young & Thompson |
| 主权项 | 1. An encapsulating composition for a light emitting device, comprising: a transparent resin; a plurality of light scattering particles distributed throughout said transparent resin and having an average particle size ranging from 190 nm to 450 nm; and a plurality of phosphor particles distributed throughout said transparent resin, wherein said light scattering particles are in an amount ranging from 0.063 to 0.15 part by weight based on 100 parts by weight of said transparent resin. | ||
| 地址 | Taichung TW | ||