Device and method for measuring dynamic thermal conductivity of micro-structure fluid

摘要

A device and method for measuring dynamic thermal conductivity of micro-structure fluid. The device includes an upper fixing plate (110a) and a lower fixing plate (110b) which are vertically spaced apart from each other, a lower body (150b) which defines a side surface of a separation space formed between the upper fixing plate and the lower fixing plate, a rotating plate (120) which is disposed in the separation space in such a way that gaps are respectively formed among the rotating plate and the upper and lower fixing plates, a shaft (140) which passes through the upper fixing plate and is coupled to the rotating plate, a heater which installed on an upper portion of the upper fixing plate, and thermocouples (118a) and (118b) which are respectively installed in the upper and lower fixing plates.

主权项

1. A device for measuring dynamic thermal conductivity of micro-structure fluid, comprising:
an upper fixing plate and a lower fixing plate vertically spaced apart from each other; a lower body defining a side surface of a separation space formed between the upper fixing plate and the lower fixing plate; a rotating plate disposed in the separation space in such a way that gaps are respectively formed between the rotating plate and the upper fixing plate and between the rotating plate and the lower fixing plate; a shaft passing through the upper fixing plate, the shaft being coupled to the rotating plate; a heater installed on an upper portion of the upper fixing plate; and a thermocouple installed in each of the upper and lower fixing plates, wherein when the rotating plate is rotated, the micro-structure fluid loaded in the separation space is under a dynamic state, and then the thermocouples measure a temperature difference of the micro-structure fluid which is caused by a constant heat flux applied by the heater, thus calculating the dynamic thermal conductivity of the micro-structure fluid.