SURFACE-TREATED ROLLED COPPER FOIL, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

[Problem to be solved] The present invention provides a surface-treated rolled copper foil that has excellent etching characteristics and bending characteristics, is excellently bonded to a resin, and also, has excellent transparent characteristics of a resin after a copper foil is removed through etching. [Solution] In a copper coated laminate in which at least one surface and/or both surfaces of the surface-treated rolled copper foil satisfy 2.5 <= I{110}/I{112} <= 6.0, the at least one surface and/or both surfaces of the surface-treated rolled copper foil are treated, and the surface-treated roller copper foil and polyimide having ΔB(PI) of not less than 50 and not more than 65 before the polyimide is attached to the copper foil are laminated. A color difference (ΔE*ab) based on JIS Z 8730 on the surface over the polyimide becomes 50. If the surface-treated rolled copper foil is combined on both surfaces of a polyimide resin substrate from the surface that is treated, the rolled copper foil on both surfaces of the polyimide resin substrate is removed through etching, a printed material is laid under the polyimide substrate, and the printed material is photographed by a CCD camera from the polyimide substrate, Sv defined in the following equation (1) is not less than 3.0. The equation (1) is Sv = (ΔB × 0.1)/(t1 - t2)