发明名称 Socket with routed contacts
摘要 A socket (130) employs a substrate (310) including a conductive network. As array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a roused first contact (136′) that the conductive network routes horizontally in or on the substrate (310).
申请公布号 US9306302(B2) 申请公布日期 2016.04.05
申请号 US201214391359 申请日期 2012.04.30
申请人 Hewlett Packard Enterprise Development LP 发明人 Leigh Kevin B.;Megason George D.
分类号 H01R12/00;H01R12/71;H01R12/70;H05K7/10;H05K3/32 主分类号 H01R12/00
代理机构 Patent Law Office of David Millers 代理人 Patent Law Office of David Millers
主权项 1. A socket comprising: a substrate including an insulating material and a conductive network; an array of first contacts on a top surface of the substrate and arranged to engage an integrated circuit; an array of second contacts on a bottom surface of the substrate and arranged to engage a circuit board, an array of third contacts on a too surface of the substrate and arranged to engage conductive media; and a flex connector comprising a flexible cable connected to the third contacts; wherein: the conductive network electrically connects the first contacts respectively to the second contacts; and the first contacts include a routed first contact that the conductive network routes horizontally in or on the substrate.
地址 Houston TX US