发明名称 |
Socket with routed contacts |
摘要 |
A socket (130) employs a substrate (310) including a conductive network. As array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a roused first contact (136′) that the conductive network routes horizontally in or on the substrate (310). |
申请公布号 |
US9306302(B2) |
申请公布日期 |
2016.04.05 |
申请号 |
US201214391359 |
申请日期 |
2012.04.30 |
申请人 |
Hewlett Packard Enterprise Development LP |
发明人 |
Leigh Kevin B.;Megason George D. |
分类号 |
H01R12/00;H01R12/71;H01R12/70;H05K7/10;H05K3/32 |
主分类号 |
H01R12/00 |
代理机构 |
Patent Law Office of David Millers |
代理人 |
Patent Law Office of David Millers |
主权项 |
1. A socket comprising:
a substrate including an insulating material and a conductive network; an array of first contacts on a top surface of the substrate and arranged to engage an integrated circuit; an array of second contacts on a bottom surface of the substrate and arranged to engage a circuit board, an array of third contacts on a too surface of the substrate and arranged to engage conductive media; and a flex connector comprising a flexible cable connected to the third contacts; wherein: the conductive network electrically connects the first contacts respectively to the second contacts; and the first contacts include a routed first contact that the conductive network routes horizontally in or on the substrate. |
地址 |
Houston TX US |