| 发明名称 | Polishing composition | ||
| 摘要 | The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water. | ||
| 申请公布号 | US9303191(B2) | 申请公布日期 | 2016.04.05 |
| 申请号 | US201314359357 | 申请日期 | 2013.03.28 |
| 申请人 | NITTA HAAS INCORPORATED | 发明人 | Hosokawa Koichiro;Ota Yoshiharu;Yoshida Shoichiro |
| 分类号 | C09G1/02;H01L21/321;C09K3/14 | 主分类号 | C09G1/02 |
| 代理机构 | Clark & Brody | 代理人 | Clark & Brody |
| 主权项 | 1. A polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water, wherein the strong acid and the hydrogen-ion-supplying agent are blended into the polishing composition at a ratio of strong acid:hydrogen-ion-supplying agent=1:1 to 1:50 in terms of the molar concentration ratio of the hydrogen ions ionized from the respective components. | ||
| 地址 | Osaka JP | ||