发明名称 |
Deposition apparatus, method for forming thin film using the same, organic light emitting display apparatus and method for manufacturing the same |
摘要 |
A deposition apparatus is configured to form a deposition layer on a substrate. The deposition apparatus includes a deposition source configured to face a first side of the substrate and to spray one or more depositing materials toward the substrate, a cooling stage configured to support a second side of the substrate that is opposite from the first side of the substrate, and a hardening unit configured to harden the one or more depositing materials sprayed from the deposition source and that have reached the substrate. A method of forming a thin film deposition layer on a substrate by using a deposition apparatus is also provided. The method includes spraying one or more depositing materials toward the substrate by using a deposition source of the deposition apparatus while the substrate is on a cooling stage of the deposition apparatus. |
申请公布号 |
US9306192(B2) |
申请公布日期 |
2016.04.05 |
申请号 |
US201313965182 |
申请日期 |
2013.08.12 |
申请人 |
Samsung Display Co., Ltd. |
发明人 |
Huh Myung-Soo;Kim Sun-Ho;Joo Hyun-Woo;Kim Jae-Hyun |
分类号 |
H01L51/56;H01L51/00;H01L51/52 |
主分类号 |
H01L51/56 |
代理机构 |
Lewis Roca Rothgerber Christie LLP |
代理人 |
Lewis Roca Rothgerber Christie LLP |
主权项 |
1. A method of forming a thin film deposition layer on a substrate by using a deposition apparatus, the method comprising:
forming, on the substrate, an inorganic layer; and forming, on the inorganic layer, an organic layer to cover one or more particles on the inorganic layer and to have a curved surface corresponding to a shape of each of the one or more particles, the forming of the organic layer comprising:
spraying one or more depositing materials toward the substrate by using a deposition source of the deposition apparatus while the substrate is on a cooling stage of the deposition apparatus; andhardening the one or more depositing materials by irradiating the one or more depositing materials using a hardening unit of the deposition apparatus after the one or more depositing materials have reached the substrate. |
地址 |
Yongin-si KR |