发明名称 |
Multilayer ceramic electronic component and manufacturing method thereof |
摘要 |
There are provided a multilayer ceramic electronic component that does not require a heat treatment under a reduction atmosphere, and a manufacturing method thereof, wherein a conductive oxide is used as a material of internal and external electrodes and conductive layers having elasticity are formed on the external electrodes. In the case of the multilayer ceramic electronic component, a firing process may be performed under an air atmosphere, such that a manufacturing process may be simplified and manufacturing costs may be reduced. |
申请公布号 |
US9305686(B2) |
申请公布日期 |
2016.04.05 |
申请号 |
US201213633508 |
申请日期 |
2012.10.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Kang Byung Sung;Seo Byung Kil |
分类号 |
H01F5/00;H01C7/10;H01G4/008;H01L41/43;H01L41/047;H01L41/083;H01L41/293;H01L41/297;H01C7/00;H01F17/00;H01F27/29 |
主分类号 |
H01F5/00 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. A multilayer ceramic electronic component comprising:
a ceramic body; internal electrodes multilayered within the ceramic body and including a first conductive oxide; and external electrodes formed on outer surfaces of the ceramic body, connected to the internal electrodes, and including a second conductive oxide, wherein the first conductive oxide and the second conductive oxide are the same conductive oxide, and wherein the first conductive oxide and the second conductive are an indium-tin oxide. |
地址 |
Gyunggi-Do KR |