发明名称 System and method for black silicon etching utilizing thin fluid layers
摘要 Systems and methods for etching the surface of a substrate may utilize a thin layer of fluid to etch a substrate for improved anti-reflective properties. The substrate may be secured with a holding fixture that is capable of positioning the substrate. A fluid comprising an acid and an oxidizer for etching may be prepared, which may optionally include a metal catalyst. An amount of fluid necessary to form a thin layer contacting the surface of the substrate to be etched may be dispensed. The fluid may be spread into the thin layer utilizing a tray that the substrate is dipped into, a plate that is placed near the surface of the substrate to be etched, or a spray or coating device.
申请公布号 US9306094(B2) 申请公布日期 2016.04.05
申请号 US201414467422 申请日期 2014.08.25
申请人 Natcore Technology, Inc. 发明人 Levy David Howard;Zubil Theodore;Topel, Jr. Richard W.;Ahearn Wendy G.
分类号 H01L31/0236;H01L31/18;H01L21/02;H01L21/306;H01L21/3213;H01L21/67;H01L31/0224;H01L31/068 主分类号 H01L31/0236
代理机构 Winstead PC 代理人 Winstead PC
主权项 1. A method for anti-reflective etching the surface of a substrate, the method comprising: securing the substrate with a holding fixture, wherein the holding fixture controls positioning of the substrate; preparing a fluid, wherein the fluid comprises an acid and an oxidizer; dispensing the fluid, wherein the fluid is dispensed into a tray, and the fluid contacts the substrate after being dispensed; spreading the fluid onto the substrate into a thin layer with a thickness of 5 mm or less, wherein the fluid is dispersed into the thin layer with the thickness by positioning the first surface of the substrate a predetermined distance from a bottom surface of the tray without submerging the substrate in the fluid, the fluid is spread by moving the substrate into the tray, moving the tray toward the substrate, or a combination thereof, the substrate enters the fluid at an angle of 20 to 60 degrees, the thin layer contacts a first surface of the substrate for a predetermined time, and the thickness of the fluid is controlled by controlling a separation distance between the first surface of the substrate and an opposing surface of a dispersion mechanism opposite the first surface, and the fluid is not in contact with a second surface of the substrate opposite the first surface; and removing the thin layer of fluid from the substrate, wherein the first surface of the substrate has reduced reflectivity.
地址 Rochester NY US