Optical device and manufacturing method therefor

摘要

An optical device includes an SOI substrate, the embedded insulating layer having a thickness of 200 nanometers (nm) or less; an optical waveguide comprising a Group III-V compound semiconductor material formed on top of the SOI substrate; and an optical leakage preventing layer formed inside the SOI substrate on a bottom side of the optical waveguide to prevent leakage of light from inside the optical waveguide towards the SOI substrate.

主权项

1. A method for manufacturing an optical device, the method comprising:
etching an SOI substrate having an embedded insulating layer with a thickness of 200 nm or less to form a groove passing through the insulating layer from the surface of the SOI substrate; forming a Group III-V compound semiconductor layer; bonding together the SOI substrate with a formed groove and the Group III-V compound semiconductor layer so the opening of the groove faces the Group III-V compound semiconductor layer; and etching the Group III-V compound semiconductor layer to form an optical waveguide.