| 发明名称 |
Adhesive for electronic component |
| 摘要 |
An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator. |
| 申请公布号 |
US9305892(B2) |
申请公布日期 |
2016.04.05 |
| 申请号 |
US201414267511 |
申请日期 |
2014.05.01 |
| 申请人 |
HENKEL AG & CO. KGAA;HENKEL IP & HOLDING GMBH |
发明人 |
Yoko Sugiura;Yusuke Horiguchi;Sano Mieko;Hoang Gina |
| 分类号 |
H01L21/00;H01L23/00;C09J133/06;C09J133/08;C09J201/02;C09J4/06;H01L21/78;H05K1/03;C09J151/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
Bauman Steven C. |
| 主权项 |
1. An adhesive composition for a pre-applied underfill sealant comprising:
(a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, wherein the polar group is selected from the group consisting of hydroxyl, carboxyl, (meth)acrylovl and epoxy group, and the polymer has a weight-average molecular weight in the range of 10,000 to 1,000,000, (c) a filler having an average particle diameter of less than 1 μm, and (d) a thermal radical initiator,wherein the adhesive composition is in the form of a film having a thickness not less than 5 μm and not more than 100 μm. |
| 地址 |
Duesseldorf DE |
