发明名称 Methods for integrated circuit analysis
摘要 A simulation method for simulating a three-dimensional structure, comprises the steps of: discretizing the three-dimensional structure into two-dimensional (“2-D”) layers; constructing a two-dimensional basis for each of the 2-D layers; and constructing a one-dimensional finite difference basis between the 2-D layers.
申请公布号 US9305124(B2) 申请公布日期 2016.04.05
申请号 US201213451504 申请日期 2012.04.19
申请人 Lorentz Solution, Inc. 发明人 Han Youngae;Zhao Jinsong
分类号 G06F17/50 主分类号 G06F17/50
代理机构 Venture Pacific Law, PC 代理人 Venture Pacific Law, PC
主权项 1. A simulation method executed on a computing device for simulating a three-dimensional structure, such that two-dimensional layered meshing models three-dimensional current flow, comprising the steps of: discretizing the three-dimensional structure into two-dimensional (“2-D”) layers, such that each of the 2-D layers having mesh nodes, such that the mesh nodes for a certain one of the 2-D layers and the respective mesh nodes of one or more other ones of the 2-D layers are non-connectable by perpendicular lines through the 2-D layers, and such that the 2-D layers have varied meshing densities to capture current distribution utilizing adaptive meshing; constructing a two-dimensional basis for each of the 2-D layers; and constructing a one-dimensional finite difference basis between the 2-D layers, such that a synchronization voltage difference between points that span across adjacent layers of the 2-D layers is determined, such that the points are connected, and such that the connected points have different voltage values.
地址 Santa Clara CA US