RESIN COMPOSITION FOR INSULATING FILM

摘要

The present invention relates to a resin composition for an insulation film. More specifically, the present invention relates to a resin composition for highly efficient insulation film for printed circuit boards, having low coefficient of expansion, low dissipation factor, and strong adhesiveness with metal. According to the present invention, it is possible to easily control reactivity and remarkably lower the dissipation factor. In addition, the resin composition can increase adhesiveness of the insulation film with metal. Further, it is possible to obtain a resin used for the insulation film exhibiting low dissipation factor.