发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device in which replacement work of a tool can be carried out without degrading an operation rate of the device.SOLUTION: A substrate processing device includes a conveyance mechanism 2 for conveying a substrate, a guide frame 3a, and first and second processing heads 5, 6. The guide frame 3a is arranged and extended above the conveyance mechanism 2 between a processing area, a first standby area, and a second standby area. The processing area is an area for processing the substrate. The first standby area is an area set outside the processing area on one side of the conveyance mechanism 2. The second standby area is an area set outside the processing area on the other side of the conveyance mechanism 2. The first processing head 5 is movably supported by the guide frame 3a between the processing area and the first standby area. The second processing head 6 is movably supported by the guide frame 3a between the processing area and the second standby area.SELECTED DRAWING: Figure 1
申请公布号 JP2016043461(A) 申请公布日期 2016.04.04
申请号 JP20140171165 申请日期 2014.08.26
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 HIRONO YOSHIFUMI
分类号 B23D1/06;B23Q17/24;B28D1/20;B65G49/06;H01L21/677;H01L31/18 主分类号 B23D1/06
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