| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of deterioration in connection reliability between conductor circuits connected via a via conductor.SOLUTION: A method of manufacturing a printed wiring board includes: preparing an insulating layer which comprises a reinforcing layer containing a reinforcing material and a resin layer formed on the reinforcing layer and containing no reinforcing material; laminating a metal foil on the resin layer of the insulating layer; forming a through-hole penetrating the metal foil and the insulating layer with a laser; removing the metal foil from the insulating layer; subjecting a surface of the resin layer of the interlayer resin insulating layer to roughening treatment; forming a conductor layer on the resin layer of the insulating layer; and forming a via conductor in the through-hole.SELECTED DRAWING: Figure 1 |
