发明名称 COMPONENT CRIMPING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a component crimping apparatus which allows for bulk crimping of components with high degree of freedom depending on the arrangement pitch of components, while enhancing the work efficiency.SOLUTION: The lower area of a plurality of electrodes 2d, out of the lower surface area of a substrate 2, is supported by the transparent member 13b of a lower receiving part 13, and when pressing a component 3 against the substrate 2, the lower surface of which is supported by the lower receiving part 13, by means of a plurality of crimp tools 32T, an adhesive member 4 is irradiated with light 15L from the lower surface side of the substrate 2 through the transparent member 13b. The plurality of crimp tools 32T are movable freely in the arrangement direction thereof, and since the transparent member 13b has dimensions capable of covering the whole area of the movable range of the plurality of crimp tools 32T in the arrangement direction, the whole area of the transparent member 13b can be irradiated with the light 15L from a light irradiation unit 15.SELECTED DRAWING: Figure 1
申请公布号 JP2016046281(A) 申请公布日期 2016.04.04
申请号 JP20140167102 申请日期 2014.08.20
申请人 PANASONIC IP MANAGEMENT CORP 发明人 YAMADA AKIRA;TSUJI SHINJIRO;ADACHI SATOSHI;TSUBOI YASUTAKA;TSUJIKAWA TOSHIHIKO
分类号 H01L21/60;H05K3/32;H05K13/04 主分类号 H01L21/60
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