| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem of a glass interposer, where the base material itself is an insulation layer material and the electrical characteristics are excellent, that the thermal conductivity is inferior, and to provide a glass interposer where the heat dissipation characteristics are improved.SOLUTION: In a glass interposer 1 including a plurality of through electrodes 5 penetrating a glass base material in the glass base material, and a plurality of wiring layers 3 and insulation layers 2 alternately on the front and back of the glass base material 4, the diameter of the through electrode 5 on the chip connection side is larger than that of the through electrode 5 on the board connection side, and in the range of 1.05-4 times.SELECTED DRAWING: Figure 1 |
