| 摘要 |
A composite wiring substrate comprises: a first wiring substrate having an opening to receive an electronic component, and including a plurality of first connection pads on an upper surface and a plurality of second connection pads on a lower surface respectively; and a second wiring substrate having the electronic component mounted on a lower surface, including a third connection pad bonded to the first connection pad through soldering in the an outer circumference side of a lower surface, and disposed on the first wiring substrate so as to cover the opening. An inner wall conductor layer for grounding is deposited on an inner wall of the opening by surrounding the electronic component, and a conductor layer for grounding is deposited on the lower surface of the second wiring substrate connected through soldering in the inner wall conductor layer. |
