发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING APPARATUS AND PROGRAM |
摘要 |
PROBLEM TO BE SOLVED: To provide an art to control a work function of a thin film by forming the thin film by using a halogen material gas and an organic material gas.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming a first layer containing a first element and a second element by performing a predetermined number of times in a time-division manner, a process of supplying a halogen material gas containing the first element to a substrate and a process of supplying to the substrate, a reaction gas which contains the second element and reacts with the first element; and a process of forming a second layer containing the first element and the second element by performing a predetermined number of times in a time-division manner, a process of supplying an organic material gas containing the first element to the substrate and a process of supplying a reaction gas to the substrate. In the semiconductor device manufacturing method, by performing the process of forming the first layer and the process of forming the second layer a predetermined number of times in a time-division manner, a thin film containing the first element and the second element is formed on the substrate.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016046339(A) |
申请公布日期 |
2016.04.04 |
申请号 |
JP20140168233 |
申请日期 |
2014.08.21 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
HARADA KAZUHIRO;OGAWA ARITO;IZUGAI MOTOMU;KITAMURA TADASHI;ASHIHARA YOJI |
分类号 |
H01L21/285;C23C16/455;H01L21/31 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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