| 摘要 |
PROBLEM TO BE SOLVED: To detect abnormal portions, such as cracking and chipping occurring in a semiconductor wafer after back grinding, accurately.SOLUTION: A protective tape PT is peeled from a semiconductor wafer W integrally, by sticking a peeling tape Ts to the protective tape PT, stuck to the semiconductor wafer W by means of a tabular peeling member 20 tapered toward the tip, and then peeling the peeling tape Ts while folding. In the peeling process, abnormal portions such as cracking and chipping occurring on the surface of the semiconductor wafer W, peeled from the protective tape PT, is detected by means of a detector 11 following the rear of the peeling member 20.SELECTED DRAWING: Figure 6 |
