| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding connection type chip resistor which improves heat dissipation and surge resistance, and a packaging structure therefor.SOLUTION: A chip resistor 1 includes: an insulation substrate 2 in a rectangular parallelepiped shape; a pair of front-side electrodes 3 and 4 which are formed along sides 2a and 2b opposing each other on a front face of the insulation substrate 2; and a resistive element 5 which is formed to be connected to the front-side electrodes 3 and 4. A planar shape of the pair of front-side electrodes 3 and 4 is formed in a trapezoidal shape that occupies one side (2a or 2b) of the insulation substrate 2, and inclined side parts 3a and 4a of the front-side electrodes 3 and 4 are disposed oppositely in parallel with each other while interposing the resistive element 5 therebetween. In a portion where an interval between the sides 2a and 2b of the insulation substrate 2 and the inclined side parts 3a and 4a becomes substantially maximum in the front-side electrodes 3 and 4, two parts which are positioned on a diagonal on the front face of the insulation substrate 2 are defined as connection parts C for a bonding wire, respectively.SELECTED DRAWING: Figure 1 |
