发明名称 HEAT GLASS
摘要 PROBLEM TO BE SOLVED: To provide a heat glass arranged by making an appropriate combination of an exothermic unit with a transmittance of 80% or more in a wavelength region of 400-1500 nm, and a material of 1% or less in both transmittance and reflectance, and forming the exothermic unit on a front face and/or a backside of a glass board with good adhesion, which is superior in water resistance and pressure resistance and adaptive to a larger size of a glass board (100×100 cm or larger in size).SOLUTION: A heat glass system comprises: an exothermic unit composed of a thin film formed by preparing a paste of materials, i.e. ITO(indium-tin-oxide) prepared by thermal decomposition and NTA glass (conductive glass including, as primary components, oxides of vanadium, barium and iron) and making a print of the paste on a glass board by screen printing, followed by sintering; electrodes for power source supply composed of a silver thin film formed in the same way; and a silicone film which makes a cover for ensuring a water resistance and the performance of being resistant against (electric) pressure. Forming holes extending through the glass board from its front face to the backside, a non-heating area in a wiring region can be reduced and a compact system including a set of heat glass boards can arranged.SELECTED DRAWING: Figure 1
申请公布号 JP2016046237(A) 申请公布日期 2016.04.04
申请号 JP20140184626 申请日期 2014.08.26
申请人 TOKAI INDUSTRY CORP 发明人 MATSUSHITA MITSUGI;KOMIYA HIDETOSHI;MATSUI SHOGO;SUGAWARA MIEKO;KOBAYASHI KENICHI
分类号 H05B3/20;C03C17/04;C03C17/23;H05B3/02;H05B3/12;H05B3/26 主分类号 H05B3/20
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