发明名称 PACKAGE BODY
摘要 PROBLEM TO BE SOLVED: To provide a package body which has adequate low-temperature sealability (impurity sealability and hot tack properties) even when a heat seal resin layer of a bottom material and a lid material is a propylene resin, and can be resealed by only pressure-crimping due to a finger.SOLUTION: There is a package body which is a multilayer film formed by sequentially laminating a surface resin layer (A), an adhesive resin layer (B), a peelable resin layer (C), and a heat seal resin layer (D). The layer (B) is formed of a layer containing a styrene-based thermoplastic elastomer having a loss tangent peak temperature of -35°C or higher as a main component. The layer (D) is formed of a layer containing a random polypropylene-based adhesive resin having a Vicat softening point of 80°C or higher and 105°C or lower, a peak value of a weight average molecular weight of 400,000 or more and 500,000 or less, and a ratio between the weight average molecular weight and a number average molecular weight of 1.5 or more and 2.3 or less, as a main component.SELECTED DRAWING: Figure 1
申请公布号 JP2016043964(A) 申请公布日期 2016.04.04
申请号 JP20140169984 申请日期 2014.08.25
申请人 MITSUBISHI PLASTICS INC 发明人 AMAO KIMIAKI
分类号 B65D77/20;B32B27/00;B65D1/28;B65D65/40 主分类号 B65D77/20
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