| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film forming method for hardly having a separation of a thin film or a substrate crack because of a high stress to be applied to a substrate from a thin film formed continuously all over the surface of the substrate, because a thin film is also formed on the inner side wall of a groove and because the thin film on the substrate surface continues all over the substrate in the case where the thin film is formed by using a sputtering method on the substrate surface having a rectangle groove in a sectional view.SOLUTION: On the surface of a substrate 4, there are formed a counter-tapered groove 5 having a narrow opening and a wide inside, and an area 6 divided by the groove 5, and thin films 7 and 8 are formed by a PVD method over the substrate 4 having the groove 5 formed, thereby to attain the divided thin film 7.SELECTED DRAWING: Figure 1 |
