| 摘要 |
According to an embodiment of the present invention, a light emitting device package comprises: a substrate; a light emitting structure which is arranged below the substrate and comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; first and second pad units which are connected to the first and second conductive semiconductor layers, respectively; first and second solder units connected to the first and second pad units; and first and second lead frames connected to the first and second solder units. At least one among the first pad unit, the second pad unit, the first solder unit, and the second solder unit has a planar shape which is separated and arranged into a plurality of sections. The light emitting device package has improved reliability by minimizing or preventing damage caused by differences in thermal expansion coefficients among different layers. |
