发明名称 ADHESIVE COMPOSITION AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in low-temperature curability and storage stability.SOLUTION: An adhesive composition according to the present invention comprises (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) a salt comprising boron, where (d) the salt comprising boron is a compound represented by general formula (A) [where, R, R, R, Rand Rindependently represent a hydrogen atom or a C1-C18 alkyl group and R, Rand Rindependently represent an aryl group].SELECTED DRAWING: None
申请公布号 JP2016044222(A) 申请公布日期 2016.04.04
申请号 JP20140168695 申请日期 2014.08.21
申请人 HITACHI CHEMICAL CO LTD 发明人 IZAWA HIROYUKI;MORIJIRI TOMOKI;SUGIMOTO YASUSHI
分类号 C09J201/00;C09J4/00;C09J5/00;C09J9/02;C09J11/04;C09J11/06;H01B1/20;H01L21/60 主分类号 C09J201/00
代理机构 代理人
主权项
地址