PROCESS KIT FOR ETCHING SEMICONDUCTOR WAFER

摘要

Disclosed is a process kit for etching a semiconductor wafer. The process kit for etching a semiconductor wafer includes: a receiving plate (100) of which one side surface is opened, and which has an introduction recess for accommodating a mask introduced into the one side surface formed on a surface thereof; a base plate (200) having a holding part (210) of the same thickness as the receiving plate (100) protruding from an upper surface thereof, and having at least one through-hole (220) formed on a surface thereof; and at least one lifting bar (300) that passes through the through-hole (220) formed on the surface of the base plate (200) and is fastened to the bottom surface of the receiving plate (100). The lift bar (300) elevates the receiving plate (100), so the receiving plate (100) comes in contact with or is separated from the base plate (200). When the receiving plate (100) is in contact with the base plate (200), a tetragonal hollow is formed.