| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in both heat resistance after curing and moldability.SOLUTION: The resin composition for molded underfill contains (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a maleimide compound. The curing accelerator (C) contains a compound represented by general formula (I-1). In the formula (I-1), Rto Rare each independently a 1-18C hydrocarbon group; at least one of Rto Ris a 1-18C aliphatic hydrocarbon group; two or more of Rto Rmay be bonded together to form a cyclic structure; Rto Rare each independently a hydrogen atom, a hydroxyl group, or a 1-18C organic group; and two or more of Rto Rmay be bonded together to form a cyclic structure.SELECTED DRAWING: None |
